Stresses and Cracking During Chromia-Spinel-NiO Cluster Formation in TBC SystemsShow others and affiliations
2015 (English)In: Journal of thermal spray technology (Print), ISSN 1059-9630, E-ISSN 1544-1016, Vol. 24, no 6, p. 1002-1014Article in journal (Refereed) Published
Abstract [en]
Thermal barrier coatings (TBC) are used in gas turbines to reduce the temperatures in the underlying substrate. There are several mechanisms that may cause the TBC to fail; one of them is cracking in the coating interface due to extensive oxidation. In the present study, the role of so called chromia-spinel-NiO (CSN) clusters in TBC failure was studied. Such clusters have previously been found to be prone to cracking. Finite element modeling was performed on a CSN cluster to find out at which stage of its formation it cracks and what the driving mechanisms of cracking are. The geometry of a cluster was obtained from micrographs and modeled as close as possible. Nanoindentation was performed on the cluster to get the correct Youngâs moduli. The volumetric expansion associated with the formation of NiO was also included. It was found that the cracking of the CSN clusters is likely to occur during its last stage of formation as the last Ni-rich core oxidizes. Furthermore, it was shown that the volumetric expansion associated with the oxidation only plays a minor role and that the main reason for cracking is the high coefficient of thermal expansion of NiO. © 2015 ASM International
Place, publisher, year, edition, pages
2015. Vol. 24, no 6, p. 1002-1014
Keywords [en]
Coatings, Cracks, Expansion, Failure (mechanical), Finite element method, Gas turbines, Thermal expansion, Chromia, Cluster formations, Coating interfaces, Driving mechanism, Failure mechanism, Oxide clusters, Thermal barrier coating (TBC), Volumetric expansion, Thermal barrier coatings
National Category
Manufacturing, Surface and Joining Technology
Research subject
ENGINEERING, Manufacturing and materials engineering
Identifiers
URN: urn:nbn:se:hv:diva-7887DOI: 10.1007/s11666-015-0270-yISI: 000358965400012Scopus ID: 2-s2.0-84936882386OAI: oai:DiVA.org:hv-7887DiVA, id: diva2:845764
2015-08-132015-08-122019-01-04Bibliographically approved