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Friction Stir Welding Modelling and Simulation: Backing plate material thermal conductivity effect on temperature profile
University West, Department of Engineering Science, Division of Mechanical Engineering and Natural Sciences.
2016 (English)Independent thesis Advanced level (professional degree), 10 credits / 15 HE creditsStudent thesisAlternative title
Modellering och Simulering av Friction-Stir svetsning : Stödplattans termiska konduktivitet och dess påverkan på temperaturprofil (Swedish)
Abstract [en]

This thesis presents a FSW modelling of temperature using ANSYS APDL 16.2 (Ansys Par-ametric Design Language). It intends to predict the thermal distribution by taking into ac-count different thermal variation imposed by different backing plate material. The effect on the cooling rate, and peak temperature was studied using finite elements analysis (FEA) tech-niques. For more validity the simulation’s results were compared with temperature data ac-quired experimentally under similar conditions.

A thermal transient modelling of friction stir welding were developed, by considering a moving heat source was considered. The heat input was obtained from the friction between the tool shoulder with the workpiece in the heat transfer analysis. The heat flux is calculated in the finite element analysis model considering the heat input generation from the tool’s shoulder and probe.

An accurate temperature measurements during FSW process is a challenging task for ex-perimental measurements since it performed using thermocouples type K that embedded into the workpiece and the (TWT) tool-workpiece thermocouple to measure temperature during FSW.[1]. The peak temperature and cooling rate in different positions were registered for welds using different backing plate materials with different thermos conductivities.

By the data analysis, it was verified that the backing plate material diffusivity affects the peak temperature and cooling rate. On both, simulation and experimental results, the temperatures were higher when a material with lower thermal conductive was used as backing plate. The experimental results have validated the model, in both peak temperature and the cooling rate.

Place, publisher, year, edition, pages
2016. , 32 p.
Keyword [en]
Word1, Word2, Word3, Word4, Word5
National Category
Mechanical Engineering
URN: urn:nbn:se:hv:diva-10232Local ID: EXP800OAI: diva2:1052601
Subject / course
Mechanical engineering
Educational program
Available from: 2016-12-07 Created: 2016-12-07 Last updated: 2016-12-07Bibliographically approved

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